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130 nm SiGe BiCMOS Processes Optimize Cost and Performance

机译:130 nm SiGe BiCMOS工艺可优化成本和性能

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摘要

Sllicon Germanium (SiGe) Heterojunction Bipolar Transistors (HBTs) are capable of much better per-rnIformance than comparably sized CMOS devices. This technology advantage is critical for wireless applications designed in SiGe BiCMOS that require integration of high performance analog blocks such as a low noise front end or power amplifiers in a System-on-Chip (SoC) solution. The addition of the SiGe HBT provides the low power RF building blocks that are not available in advanced CMOS and complements the advanced digital integration of the SoC.
机译:硅锗(SiGe)异质结双极晶体管(HBT)的性能要比同等大小的CMOS器件好得多。这种技术优势对于以SiGe BiCMOS设计的无线应用至关重要,该应用需要在片上系统(SoC)解决方案中集成高性能模拟模块,例如低噪声前端或功率放大器。 SiGe HBT的添加提供了高级CMOS中不可用的低功耗RF构建模块,并补充了SoC的高级数字集成。

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