Polyimide系プラズマ支援蒸着重合膜の構造解析

摘要

Polyimide（PI）は，優れた耐熱性や電気絶縁性，枚械的rn特性，誘電率などの特長があり，電子機器や航空機などさまrnざまな分野で広く使われている高分子材料である．一般的に，rnPI薄膜を形成する方法としてウェットプロセスであるスピrnンコート法があるが，1000?以内の膜厚の薄膜積層が困難rnなことや均質な膜が得られにくいことが欠点である．これらrnの欠点を解決するために，2つの蒸着源からモノマーを蒸着rnさせる蒸着（Vacuum evaporation（VE））重合法や，イオrnンビームを援用した交互蒸着重合法を用いた研究がなされてrnいる．%Organic thin films were prepared with pyromellitic dianhydride (PMDA) and oxydianiline (ODA) by vacuum evaporation with or without argon plasma, and molecular structures and surface morphologies of the PMDA, ODA, polyamic acid (PAA) and polyimide (PI) thin films were analyzed. The surface roughness decreased due to the plasma during the deposition. Oxygen content of the PMDA thin film prepared with the plasma decreased compared to that without the plasma. However, the PMDA thin film prepared with the plasma had a hydrophilic surface compared to that without the plasma. All of these organic thin films prepared with the plasma had hydrophilic surfaces compared to those without the plasma. Surface roughness of these thin films has a smaller effect on the wettability than hydrophilic moieties.