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首页> 外文期刊>Thin Solid Films >Enhanced thermoelectric power factor in in-situ high-vacuum annealed Bi_(1-x)Sb_x films with compact morphology by magnetron sputtering
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Enhanced thermoelectric power factor in in-situ high-vacuum annealed Bi_(1-x)Sb_x films with compact morphology by magnetron sputtering

机译:通过磁控溅射,增强了原位高真空退火的Bi_(1-X)Sb_x薄膜的热电电源系数

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摘要

Thermoelectric performances of thin films are affected by both the morphology and composition of the films. On one hand, the compact morphology of films could increase electrical conductivity via boosting carrier mobility. On the other hand, for semimetal or semiconductor materials, alloying is an effective means to adjust the carrier concentration and band structure and further modulate thermoelectric performances. In this work, with an insitu high-vacuum annealing technique, we prepared compact Bi1-xSbx thin films via magnetron sputtering and further modulated their power factor by varying Sb content. Thermoelectric transport measurements revealed an enhanced room-temperature power factor up to 23.48 mu W/(cmK2) in compact Bi0.95Sb0.05 film with high carrier mobility. Our simulation results based on a tight-binding model, in conjunction with the experimentally observed mobility peak, suggest that the observation of enhanced thermoelectric power factor is possibly related to the composition-induced band structure modulation.
机译:薄膜的热电性能受到薄膜形态和组成的影响。一方面,通过升压载流子迁移率,薄膜的紧凑形态可以提高电导率。另一方面,对于半型或半导体材料,合金化是调节载流子浓度和带结构的有效手段,进一步调节热电性能。在这项工作中,利用Insitu高真空退火技术,我们通过磁控溅射制备了紧凑的BI1-XSBX薄膜,并通过改变Sb含量进一步调节它们的功率因数。热电传输测量在具有高载流子迁移率的紧凑型Bi0.95SB0.05膜中揭示了高达23.48亩/(cmk2)的增强室温功率因数。我们基于紧密结合模型的模拟结果与实验观察到的迁移峰相结合,表明增强的热电功率因数观察可能与组合诱导的带结构调制有关。

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  • 来源
    《Thin Solid Films 》 |2021年第1期| 138948.1-138948.9| 共9页
  • 作者单位

    Hangzhou Innovat Inst Beihang Univ Key Lab Intelligent Sensing Mat & Chip Integrat T Hangzhou 310051 Peoples R China;

    Hangzhou Innovat Inst Beihang Univ Key Lab Intelligent Sensing Mat & Chip Integrat T Hangzhou 310051 Peoples R China;

    Hangzhou Innovat Inst Beihang Univ Key Lab Intelligent Sensing Mat & Chip Integrat T Hangzhou 310051 Peoples R China;

    Hangzhou Innovat Inst Beihang Univ Key Lab Intelligent Sensing Mat & Chip Integrat T Hangzhou 310051 Peoples R China;

    Hangzhou Innovat Inst Beihang Univ Key Lab Intelligent Sensing Mat & Chip Integrat T Hangzhou 310051 Peoples R China;

    Hangzhou Innovat Inst Beihang Univ Key Lab Intelligent Sensing Mat & Chip Integrat T Hangzhou 310051 Peoples R China|Beihang Univ Res Inst Frontier Sci Beijing 100191 Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Bismuth antimony; In-situ annealing; Dirac band; Carrier mobility; Thermoelectric property;

    机译:铋锑;原位退火;DIRAC带;载流子迁移率;热电性;

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