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Surface roughness variation and microstructural evolution of Au thin films in rapid annealing by microwave and electric furnace heating

机译:微波和电炉加热快速退火中Au薄膜的表面粗糙度变化和微结构演化

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Microstructural evolution of Au thin film in post-annealing by microwave and by electric furnace heating was compared. Wave number spectra of film surface roughness were analyzed to characterize their roughness variation by annealing. Coarsening of film microstructure occurred consistently as the increase of the annealing temperature in both methods. Labyrinth-shaped morphologies consisting of bump-ridge crystals were formed by annealing, which might be originated from the fine-grained colonies existed in the as-deposited state. Through coalescence and growth of the grains within the colony, the bump-ridge crystals increased their height as the increase of annealing temperature. Eventually, microstructures and crystal morphologies became similar by both annealing methods above 800-850 degrees C.However, there are following differences observed in the low temperature annealing cases: 1. While a temporal variation of the film microstructure was observed in furnace annealing, microwave annealing exhibited smaller tendency of this feature. 2. Fine roughness (higher wave number range) of the films was reduced more in the temperature below 720 degrees C by microwave annealing than by furnace annealing. 3. Increase of bump-ridge height was pronounced more by microwave annealing between 600 and 800 degrees C, corresponding to the roughness increase in the lower wave number range. On the other hand, film coverage decreased. The reasons for the difference was discussed by consideration of the competition among the capillary driven surface diffusion, contribution of electro-migration and the thermodynamic equilibrium shapes of the film grain structures.
机译:微波和电炉加热均匀退火薄膜的微观结构演化。分析薄膜表面粗糙度的波数光谱,以通过退火表征其粗糙度变化。薄膜微观结构的粗化一致地发生在两种方法中的退火温度的增加。通过退火形成由凸耳晶体组成的迷宫形态,这可能来自于在沉积状态中存在的细粒菌落。通过菌落内的谷物的聚结和生长,凸耳脊晶体随着退火温度的增加而增加。最终,通过800-850摄氏度的退火方法,微结构和晶体形态变得相似。然而,在低温退火情况下观察到以下差异:1。虽然在炉退火中观察到薄膜微观结构的时间变化,但微波退火表现出该特征的较小趋势。 2.通过微波退火比通过炉退火,微波退火的温度低于720℃,薄膜的细粗糙度(较高波数范围)更低。 3.通过微波退火在600至800摄氏度之间的微波退火的增加更加发音,对应于较低波数范围内的粗糙度增加。另一方面,电影覆盖率下降。通过考虑毛细管从动表面扩散,电迁移贡献以及膜晶粒结构的热力学平衡形状的竞争来讨论差异的原因。

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