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Microstructure, optical and electrical properties of thin films of gallium- phosphorus-titanium alloys synthesized by asymmetric bipolar pulsed direct current magnetron sputtering

机译:通过非对称双极脉冲直流磁控溅射合成的镓 - 磷 - 钛合金薄膜的微观结构,光学和电性能

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摘要

Thin films of gallium-phosphorus-titanium (Ga-P-Ti) alloys were prepared on glass substrates at 573 K by an asymmetric bipolar pulsed direct current sputtering technique using an argon atmosphere and targets made from gallium phosphide (GaP) powder and metallic titanium (Ti), at the surface ratios of 8:1, 5:1, 2:1 and 1:1 GaP to Ti (GaP:Ti) on the sputtered area. Examination by X-ray diffraction, transmission electron microscopy, and field emission scanning electron microscope indicated that the as-deposited films from the sputtering targets having GaP:Ti ratios of 8:1, 5:1, and 2:1 were polycrystalline with the cubic zinc-blende crystal structure having GaP as the host material, i.e., Ti-doped GaP. Elemental compositions of the film obtained from the target at a GaP:Ti ratio of 5:1 closely resembled the theoretically predicted intermediate band compound Ga4P3Ti. It was projected that the Ga4P3Ti compound could be fabricated by co-sputtering of GaP and Ti from a single target having the surface area ratio GaP:Ti of 3.5:1. Optical transmission and reflection spectra, temperature dependence of electrical resistivity, and light response of the electrical resistivity showed semiconductor-like behavior for the films obtained from the targets with the GaP:Ti of 8:1 and 5:1, and were metal-like for those deposited from the other targets. Optical band gaps determined from the transmission spectrum of the semiconducting films by Tauc's expression for indirect transition were 1.2-1.5 eV. The results of the study could provide an alternative route for fabricating the intermediate band material based on the Ga-P-Ti system.
机译:在573k的玻璃基板上通过不对称的双极脉冲直流溅射技术在573k的玻璃基板上制备薄膜,使用氩气氛和由磷化镓(间隙)粉末和金属钛制成的靶标(TI),在溅射区域上的8:1,5:1,2:1和1:1:1间隙的表面比率在溅射区域上至Ti(间隙:Ti)。通过X射线衍射,透射电子显微镜和场发射扫描电子显微镜检测表明,来自溅射靶具有间隙的溅射膜:Ti比为8:1,5:1和2:1是多晶的多晶立方锌 - 熔化晶体结构具有间隙作为主体材料,即Ti掺杂间隙。从靶的间隙中获得的膜的元素组合物:Ti比为5:1与理论上预测的中间带化合物Ga4p3Ti相似。预计Ga4P3Ti化合物可以通过从具有表面积比间隙的单个靶的间隙和Ti的间隙和Ti溅射来制造Ga4P3Ti化合物:Ti为3.5:1。光学传输和反射光谱,电阻率的温度依赖性以及电阻率的光响应显示了从具有间隙所获得的膜的膜的半导体样行为:Ti为8:1和5:1,是金属状的对于那些沉积来自其他目标的人。通过Tauc的间接转变的Xuc的半导体膜的透射谱确定光带间隙为1.2-1.5eV。该研究的结果可以提供基于GA-P-TI系统制造中间带材料的替代路线。

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