A study on the electromagnetic wave shielding property of photosintered copper-silver composite films

摘要

Research on photosintering of printable conductive nano-metal ink or metal oxide ink is a very advantageous method in manufacturing flexible devices because it can reduce thermal shock when electrodes are formed on a flexible substrate. In this study, silver (Ag) metal organic deposition (MOD) ink was added to copper (Cu) MOD ink to improve the electromagnetic wave shielding (EMS) property of Cu films sintered by light. Increasing the concentration of Ag up to 2 wt% greatly increases the light absorption, electrical conductivity, and EMS effectiveness. Beyond 2 wt%, the composite films showed similar electrical properties to those of Cu-Ag film with 2 wt % Ag. It has been found that by adjusting the light energy, the proper sintering energy of the Cu-Ag film is lowered by the light absorption property of Ag, and the shielding efficiency value can be improved by reducing the thermal damage of the final MOD film.