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首页> 外文期刊>Thin Solid Films >Plasma enhanced chemical vapor deposition of silicon oxide films using TMOS/O_2 gas and plasma diagnostics
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Plasma enhanced chemical vapor deposition of silicon oxide films using TMOS/O_2 gas and plasma diagnostics

机译:使用TMOS / O_2气体和等离子体诊断程序进行等离子体增强的氧化硅膜化学气相沉积

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摘要

Thin oxide films are deposited from tetramethoxysilane in an inductively coupled oxygen glow discharge supplied with radio frequency power. The deposition rate and the chemical bonding states of deposited films are analyzed by ellipsometry and by Fourier transform infrared spectroscopy, respectively, and the intensities of light emission from molecules and radicals in the plasma are measured by optical emission spectroscopy. Langmuir probe is employed to estimate the plasma density and electron temperature. With these tools, the effects of parameters such as r.f. power of inductive coupling, substrate bias power, oxygen partial pressure ratio, total pressure on the properties of the film and of the plasma are investigated. The correlation between the properties of the film and the characteristics of the plasma are explained wherever possible.
机译:氧化膜由四甲氧基硅烷在感应耦合的氧气辉光放电中沉积,并提供射频功率。分别通过椭圆光度法和傅立叶变换红外光谱法分析沉积膜的沉积速率和化学键合状态,并通过光发射光谱法测量等离子体中分子和自由基的光发射强度。 Langmuir探针用于估计等离子体密度和电子温度。使用这些工具,可以得到诸如r.f.研究了感应耦合的功率,衬底的偏置功率,氧分压比,总压力对薄膜和等离子体性能的影响。尽可能解释膜的性质与等离子体的性质之间的相关性。

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