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Deposition and structural characterization of poly-Si thin films on Al-coated glass substrates using hot-wire chemical vapor deposition

机译:热线化学气相沉积法在镀铝玻璃基板上沉积多晶硅薄膜及结构表征

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摘要

The growth of polycrystalline Si films onto Al-coated Corning 7059 glass substrates using hot-wire chemical vapor deposition (HW-CVD) was investigated. The crystalline fraction, grain structure and average grain size of the films were compared as a function of the growth rate and the Si/Al thickness ratio. Micrometre-size Si grains were achieved with a Si/Al ratio of 2 and Si thickness of 2 mum at a growth rate of 1 mum h(-1). It was found that the films had a bimodal grain size distribution, which included nanocrystalline Si, and that the growth of micrometre-size crystallites does not continue as the thickness of Si film increases. At a growth rate of 5 mum h(-1), films are similar to those grown on glass with an average grain size less than 60 urn and crystalline fraction of similar to75%. (C) 2003 Elsevier Science B.V. All rights reserved. [References: 9]
机译:研究了使用热线化学气相沉积(HW-CVD)在Al涂层的Corning 7059玻璃基板上生长多晶Si膜的过程。比较了薄膜的晶体分数,晶粒结构和平均晶粒尺寸与生长速率和Si / Al厚度比的关系。硅/铝比为2,硅厚度为2微米,以1微米h(-1)的生长速度实现了微米级的硅晶粒。发现该膜具有包括纳米晶体Si的双峰晶粒尺寸分布,并且随着Si膜厚度的增加,微米级晶粒的生长不会持续。以5微米h(-1)的生长速度,薄膜与在玻璃上生长的薄膜相似,平均晶粒尺寸小于60微米,且晶体分数接近75%。 (C)2003 Elsevier Science B.V.保留所有权利。 [参考:9]

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