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Atomic force microscopy observations of successive damaging mechanisms of thin films on substrates under tensile stress

机译:拉伸力作用下原子薄膜对薄膜的连续破坏机理的原子力显微镜观察

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摘要

Atomic force microscopy has been used to characterize the evolution of cracks in a 100 nm thick nickel film on a polyimide substrate under increasing tensile stresses. Successive damaging mechanisms are described and discussed by means of finite element calculations.
机译:原子力显微镜已用于表征在拉伸应力增加的情况下,聚酰亚胺基材上100 nm厚镍膜中裂纹的发展。通过有限元计算来描述和讨论连续的破坏机制。

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