Damage mode tensile testing of thin gold films on polyimide substrates by X-ray diffraction and atomic force microscopy

摘要

In situ tensile testing has been performed on thin gold film, 320 nm thick, deposited on polyimide substrates. During the tensile testing, strain/stress measurements have been carried out by X-ray diffraction using the d-sin~2 ψ method. The X-ray stress analysis suggests crack formation in the films for stresses greater than 670 MPa. The surface of the deformed specimen observed by atomic force microscopy (AFM) exhibits both cracks and two types of straight-sided buckling patterns lying perpendicular to the tensile axis. These buckling patterns can have a symmetrical or asymmetrical shape. The evolution of these two kinds of buckling structures under tensile stress has been observed in situ by AFM and compared to X-ray stress data. The results indicate that symmetrical straight-sided buckling patterns are induced by the compressive stress during unloading, whereas the asymmetrical result from the delamination of the film during the tensile deformation.