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Changes in the real structure and magnetoresistance of Co_(90)Fe_(10)/Cu and Co_(90)Fe_(10)/Cu_(85)Ag_(10)Au_5 multilayers after annealing

机译:退火后Co_(90)Fe_(10)/ Cu和Co_(90)Fe_(10)/ Cu_(85)Ag_(10)Au_5多层的真实结构和磁阻的变化

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摘要

Annealing of the (1.1 nm Co_(90)Fe_(10)/2.2 nm Cu)x20 and (1.1 nm Co_(90)Fe_(10)/2.2 nm Cu_(85)Ag_(10)Au_5)x20 multilayers at 235 ℃ improved their magnetoresistance as compared to the virgin samples. Annealing at higher temperatures resulted in degradation of the magnetoresistance effect. This observation raised the motivation of a detailed structural study; using small-angle X-ray scattering, wide-angle X-ray diffraction, electron diffraction and transmission electron microscopy with the aim to link the structural changes in the system to the changes in the magnetoresistance. The structure studies have shown that the maximum of the magnetoresistance observed after annealing at 235 ℃ is related to the separation of Co_(90)Fe_(10) and Cu, which are partly intermixed at interfaces after the deposition process. The decay of the GMR effect at higher annealing temperatures is caused by an increase of the interface roughness, which led in the Co_(90)Fe_(10)/Cu multilayers to occurrence of non-continuous interfaces and to short-circuiting of magnetic layers. In the Cu_(85)Ag_(10)Au_5 multilayers, the combination of small-angle X-ray scattering and wide-angle X-ray diffraction has shown that Cu_(85)Ag_(10)Au_5 did not form an alloy with the nominal composition: Only a part of Au and Ag was dissolved in the copper structure; the remainder of Ag and Au formed precipitates.
机译:在235℃下退火(1.1 nm Co_(90)Fe_(10)/2.2 nm Cu)x20和(1.1 nm Co_(90)Fe_(10)/2.2 nm Cu_(85)Ag_(10)Au_5)x20多层膜的退火与原始样品相比,它们的磁阻得到了改善。较高温度下的退火导致磁阻效应的降低。这一发现激发了进行详细结构研究的动机。使用小角X射线散射,广角X射线衍射,电子衍射和透射电子显微镜,目的是将系统的结构变化与磁阻变化联系起来。结构研究表明,在235℃退火后观察到的最大磁阻与Co_(90)Fe_(10)和Cu的分离有关,而Co_(90)Fe_(10)和Cu的沉积在沉积过程中部分混在界面上。 GMR效应在较高退火温度下的衰减是由界面粗糙度的增加引起的,这导致Co_(90)Fe_(10)/ Cu多层膜中出现了不连续的界面并导致了磁性层的短路。在Cu_(85)Ag_(10)Au_5多层膜中,小角度X射线散射和广角X射线衍射的组合显示Cu_(85)Ag_(10)Au_5不会与铝形成合金。标称成分:仅一部分Au和Ag溶解在铜结构中。其余的Ag和Au形成沉淀。

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