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Deposition of indium tin oxide thin films by cathodic arc ion plating

机译:阴极电弧离子镀沉积铟锡氧化物薄膜

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Indium tin oxide (ITO) thin films have been deposited by cathodic arc ion plating (CAIP) using sintered oxide target as the source material. In an oxygen atmosphere of 200 degrees C, ITO films with a lowest resistivity of 2.2 x 10(-4) Omega-cm Were obtained at a deposition rate higher than 450 nm/min. The carrier mobility of ITO shows a maximum at some medium pressures. Although morphologically ITO films with a very fine nanometer-sized structure were observed to possess the lowest resistivity, more detailed analyses based on X-ray diffraction are attempted to gain more insight into the factors that govern electron mobility in this investigation. (c) 2005 Elsevier B.V. All rights reserved.
机译:氧化铟锡(ITO)薄膜已通过阴极电弧离子镀(CAIP)以烧结的氧化物靶为原料进行沉积。在200℃的氧气气氛中,以高于450nm / min的沉积速率获得具有最低电阻率2.2×10(-4)Ω·cm的ITO膜。 ITO的载流子迁移率在某些中等压力下显示出最大值。尽管观察到具有非常精细的纳米级结构的形态学ITO膜具有最低的电阻率,但仍试图基于X射线衍射进行更详细的分析,以便在此研究中更深入地了解控制电子迁移率的因素。 (c)2005 Elsevier B.V.保留所有权利。

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