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Electronic structure and hardening mechanism of Si-doped/undoped diamond-like carbon films

机译:掺硅/不掺杂类金刚石碳膜的电子结构和硬化机理

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In this article, we have investigated the electronic structures of silicon-doped and undoped diamond-like carbon (DLC) thin films using Fourier transform infrared (FTIR) spectra, Raman spectra, photoluminescence (PL), and X-ray absorption near edge structure (XANES) spectroscopy. The films were deposited by Plasma-Enhanced Chemical Vapour Deposition (PECVD) method in argon atmosphere using C_2H_2 and/or Si(CH_3)_4 vapour precursors. Raman spectra displayed a decrease in (I_D/I_G) ratio for films synthesized using Si(CH_3)_4 vapour, indicative of the formation of more diamond-like (sp~3 rich) films. The PL intensities and the full width at half maximum (FWHM) of the PL band increased, whereas PL peak position shifted towards lower energies when the Si incorporation was increased in the film. FTIR spectra revealed an increase in Si-H_n and C-H_n bonding intensity at 2100 cm~(-1) and 2900 cm~(-1), respectively, with increased Si incorporation. Hardness as well as the Young's modulus changed with not only the sp~2 content present in the film, but also decrease in the three-dimensional interlinks of the C-C atomic bond structure by the C-H_n and Si-H_n weaker bonds.
机译:在本文中,我们使用傅立叶变换红外(FTIR)光谱,拉曼光谱,光致发光(PL)和X射线吸收在边缘结构附近,研究了掺杂硅和未掺杂的类金刚石碳(DLC)薄膜的电子结构。 (XANES)光谱。通过等离子体增强化学气相沉积(PECVD)方法在氩气中使用C_2H_2和/或Si(CH_3)_4气相前驱体沉积薄膜。拉曼光谱显示使用Si(CH_3)_4蒸气合成的薄膜的(I_D / I_G)比降低,这表明形成了更多类金刚石(富含sp〜3)的薄膜。 PL强度和PL带的半峰全宽(FWHM)增加,而当薄膜中增加Si掺入时,PL峰位置向较低能量移动。 FTIR光谱表明,随着Si掺入量的增加,Si-H_n键和C-H_n键强度分别在2100 cm〜(-1)和2900 cm〜(-1)增加。硬度和杨氏模量不仅随着膜中存在的sp〜2含量而变化,而且随着C-H_n和Si-H_n弱键的存在而在C-C原子键结构的三维互连中降低。

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