首页> 外文期刊>Thin Solid Films >Influence of Sn incorporation on the properties of CuInS_2 thin films grown by vacuum evaporation method
【24h】

Influence of Sn incorporation on the properties of CuInS_2 thin films grown by vacuum evaporation method

机译:掺锡对真空蒸发法生长CuInS_2薄膜性能的影响

获取原文
获取原文并翻译 | 示例
           

摘要

Structural, morphological and optical properties of Sn-doped CuInS_2 thin films grown by double source thermal evaporation method were studied. Firstly, the films were annealed in vacuum after evaporation from 250 to 500℃ for Sn deposition time equal to 3 min. Secondly, the films deposited for several Sn evaporation times were annealed in vacuum after evaporation at 500℃. The X-ray diffraction spectra indicated that polycrystalline Sn-doped CuInS_2 films were obtained and no Sn binary or ternary phases are observed for the Sn evaporation times equal to 5 min. Scanning electron microscopy observation revealed the decrease of the surface crystallinity with increasing the Sn evaporation times and the annealing temperatures. The Sn-doped samples after annealing have bandgap energy of 1.42-1.50 eV. Furthermore, we found that the Sn-doped CuInS_2 thin films exhibit N-type conductivity after annealing.
机译:研究了双源热蒸发法制备的Sn掺杂CuInS_2薄膜的结构,形貌和光学性质。首先,将薄膜从250℃蒸发至500℃,然后在真空中退火,沉积时间为3分钟。其次,将沉积数次Sn蒸发的薄膜在500℃蒸发后在真空中退火。 X射线衍射光谱表明,获得了多晶掺杂Sn的CuInS_2薄膜,并且在等于5分钟的Sn蒸发时间中未观察到Sn二元或三元相。扫描电子显微镜观察表明,随着Sn蒸发时间和退火温度的增加,表面结晶度降低。退火后的掺锡样品的带隙能为1.42-1.50 eV。此外,我们发现,掺杂锡的CuInS_2薄膜在退火后表现出N型导电性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号