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Ge diffusion and solid phase epitaxy growth to form Si_(1-x)Ge_x/Si and Ge on insulator structure

机译:Ge扩散和固相外延生长以在绝缘体结构上形成Si_(1-x)Ge_x / Si和Ge

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We report growth of Si_(1-x)Ge_x/Si and Ge on insulator by Ge diffusion and SPE (solid phase epitaxy). Different annealing conditions were carried out and evaluated by X-ray diffraction. Ge diffusion and SPE growth of Ge on Si are observed after annealing at 800 ℃. EDX (electron dispersive X-ray) composition analysis shows that the top 100 A Si_(1-x)Ge_x layer is quite uniform with Ge content variation of less than 2%. TEM (transmission electron microscopy) picture shows no crystal orientation misalignment between the Si and the top Si_(1-x)Ge_x layer. This simple and cost-effective process can be used to make Si_(1-x)Ge_x /Si substrate for high-mobility metal oxide semiconductor field effect transistor application. In addition, Ge on insulator structure was achieved by SPE lateral growth on pre-patterned SiO_2.
机译:我们报告了通过Ge扩散和SPE(固相外延)在绝缘体上生长Si_(1-x)Ge_x / Si和Ge。进行不同的退火条件并通过X射线衍射评估。在800℃退火后,观察到Ge在Si上的扩散和SPE的生长。 EDX(电子弥散X射线)成分分析表明,顶层100 A Si_(1-x)Ge_x层非常均匀,Ge含量变化小于2%。 TEM(透射电子显微镜)图片显示在Si和顶部Si_(1-x)Ge_x层之间没有晶体取向未对准。这种简单且具有成本效益的工艺可用于制造用于高迁移率金属氧化物半导体场效应晶体管应用的Si_(1-x)Ge_x / Si衬底。另外,通过在预图案化的SiO_2上进行SPE横向生长,可以在绝缘体结构上获得Ge。

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