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Aluminum-doped hydrogenated microcrystalline cubic silicon carbide films deposited by hot wire CVD

机译:热线CVD沉积铝掺杂氢化微晶立方碳化硅薄膜

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摘要

Aluminum-doped hydrogenated microcrystalline cubic silicon carbide (Al-doped mu c-3C-SiC:H) films were successfully deposited by hot wire chemical vapor deposition using a gas mixture of monomethylsilane, hydrogen and trimethylaluminum (TMA). Deposition rate and infrared absorption measurements indicate that radicals generated from TMA extract hydrogen atoms from the growing surface of the films. Infrared absorption and secondary ion mass spectroscopy measurements suggest the existence of Al-H complexes in the deposited film. The dark conductivity was found to be below 10(-7) S/Cm for as-deposited films and 10(-6)-10(-4) S/cm for annealed films. Our studies indicate the possibility of forming p-type mu c-3C-SiC:H films on glass substrates at process temperature below 400 degrees C. (c) 2005 Elsevier B.V. All rights reserved.
机译:铝掺杂的氢化微晶立方碳化硅(Al掺杂的mu c-3C-SiC:H)膜已成功通过热线化学气相沉积使用单甲基硅烷,氢气和三甲基铝(TMA)的气体混合物进行沉积。沉积速率和红外吸收测量表明,TMA产生的自由基从薄膜的生长表面提取氢原子。红外吸收和二次离子质谱测量表明,沉积膜中存在Al-H络合物。发现沉积薄膜的暗电导率低于10(-7)S / Cm,退火薄膜的暗电导率低于10(-6)-10(-4)S / cm。我们的研究表明在低于400摄氏度的加工温度下在玻璃基板上形成p型mu c-3C-SiC:H膜的可能性。(c)2005 Elsevier B.V.保留所有权利。

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