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The influence of chemical post-etching and UV irradiation on the optical absorption and thermal diffusivity of porous silicon studied by photoacoustic technique

机译:化学声刻蚀和紫外线辐射对光声技术研究的多孔硅的光吸收和热扩散率的影响

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We applied a photoacoustic (PA) technique to study the optical absorption and thermal diffusivity of porous silicon (Psi) samples. The Psi layers were formed on p-type Si wafers in an HF electrolyte. Three kinds of Psi samples that had undergone chemical post-etching were studied before and after UV irradiation for 2 h. We observed that a strong confinement effect occurred in all of the Psi samples from the blue shift of the band gap energy compared with that of crystalline Si, while the effective thermal diffusivities were almost two orders of the magnitude smaller than that of conventional Si crystals. The band gap shifted to higher energy and the effective thermal diffusivity decreased as the post-etching time increased. In the case of a Psi sample that was not chemically post-etched, the optical absorption and effective thermal diffusivity before and after UV irradiation were almost unchanged. However, for the Psi samples that were chemically post-etched, the optical absorption decreased and the effective thermal diffusivity increased after UV irradiation. This indicates that Psi samples that are post-etched are more readily affected by UV irradiation, i.e., oxidized by replacing Si-H, bonds by Si-O-x, than those that do not undergo post-etching. (c) 2005 Elsevier B.V. All rights reserved.
机译:我们应用光声(PA)技术来研究多孔硅(Psi)样品的光吸收和热扩散率。在HF电解质中的P型Si晶片上形成Psi层。在紫外线照射2 h前后,对三种经过化学后蚀刻的Psi样品进行了研究。我们观察到,与晶体硅相比,由于带隙能量的蓝移,所有Psi样品均发生了强烈的限制效应,而有效热扩散率几乎比常规Si晶体小了两个数量级。随着后蚀刻时间的增加,带隙转移到更高的能量,有效热扩散率降低。对于未经化学后蚀刻的Psi样品,UV照射前后的光吸收和有效热扩散率几乎不变。但是,对于经过化学后蚀刻的Psi样品,在紫外线照射后,光吸收降低,有效热扩散率提高。这表明后蚀刻的Psi样品比未蚀刻后的Psi样品更容易受到UV辐射的影响,即,通过用Si-O-x代替Si-H键而被氧化。 (c)2005 Elsevier B.V.保留所有权利。

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