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Plasma influence on the properties and structure of indium tin oxide films produced by reactive middle frequency pulsed magnetron sputtering

机译:等离子体对反应性中频脉冲磁控溅射制备的铟锡氧化物薄膜性能和结构的影响

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摘要

Reactive pulsed magnetron sputtering was used to produce conductive and transparent tin-doped indium oxide (ITO) films with low thickness inhomogeneity. Due to the parallel operation of two magnetrons, the deposition system allows in situ investigations of the plasma influence on the film properties. The distribution of the film resistivity, refractive index, structure and stoichiometry along the substrate are presented and related to the spatial distribution of the plasma flow escaping the magnetrons, and the substrate temperature. A higher plasma flow likely causes a localized relaxation of the distorted In-O bonds in amorphous phase which prevails in ITO films prepared at unheated substrates. This leads to a decrease of the film resistivity due to free electrons density and mobility enhancement. The free electron density increase is caused likely by generation of oxygen vacancies. Deposition on a heated substrate (T_s/T_m=0.3) leads to a change of the film growth mode due to enhanced surface diffusion of the adatoms which results in a textured low resistivity film. This also causes significant improvements of the homogeneity of the film properties that is important for ITO applications.
机译:反应性脉冲磁控溅射用于生产具有低厚度不均匀性的导电且透明的掺锡氧化铟(ITO)膜。由于两个磁控管的并行操作,沉积系统允许对等离子体对薄膜性能的影响进行原位研究。呈现了沿基板的膜电阻率,折射率,结构和化学计量的分布,并且与逃逸磁控管的等离子体流的空间分布以及基板温度有关。较高的等离子体流可能导致非晶相中扭曲的In-O键局部松弛,这在未加热的基板上制备的ITO膜中普遍存在。由于自由电子密度和迁移率提高,这导致膜电阻率降低。自由电子密度的增加可能是由氧空位的产生引起的。在加热的基板上沉积(T_s / T_m = 0.3)会导致膜生长模式的改变,这是由于吸附原子的表面扩散增强所致,从而导致了低电阻率的薄膜化。这也导致膜性能均匀性的显着改善,这对于ITO应用而言很重要。

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