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Source-drain barrier height engineering for suppressing the a-Si:H TFTs photo leakage current

机译:源极-漏极势垒高度工程,用于抑制a-Si:H TFT的光泄漏电流

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摘要

For effectively reducing the off-state signal loss resulted from the a-Si:H TFTs photo leakage current, the a-Si:H TFTs with the use of ITO as source-drain metal have been fabricated for this study. Several TFT structures have been fabricated to examine this characteristic. A remarkable reduction in photo leakage current has been observed under the 3300 cd/m~2 CCFL backlight illumination. The source-drain barrier height engineering has been proposed for these results. According to the energy band diagram, the barrier height for hole is estimated about 3 eV. As a result, the photo-generation holes blocked in the source-drain barrier height could effectively reduce the photo leakage current in off-state.
机译:为了有效地减少由a-Si:H TFT的光泄漏电流引起的截止状态信号损耗,本研究制造了使用ITO作为源漏金属的a-Si:H TFT。已经制造了几种TFT结构来检查该特性。在3300 cd / m〜2 CCFL背光照明下,可以观察到光泄漏电流的显着降低。已针对这些结果提出了源-漏势垒高度工程。根据能带图,空穴的势垒高度估计约为3 eV。结果,阻塞在源极-漏极势垒高度中的光生空穴可以有效地减小截止状态下的光泄漏电流。

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