...
首页> 外文期刊>Thin Solid Films >Covalent Integration Of Luminescent Eu (iii) Complex Onto Composite Conductors Or Semiconducting Substrates By Grafting With Organosilane
【24h】

Covalent Integration Of Luminescent Eu (iii) Complex Onto Composite Conductors Or Semiconducting Substrates By Grafting With Organosilane

机译:通过有机硅烷接枝将发光的Eu(iii)配合物共价整合到复合导体或半导体基底上

获取原文
获取原文并翻译 | 示例
           

摘要

A method to introduce the luminescent rare earth complex onto Si and indium tin oxide substrates by grafting with organosilane was presented. The organosilane, 3-aminopropyltriethoxysilane, was used as molecular bridge to link 5-(7-bromoheptyl)-5'-methyl-2,2'-bipyridine to the activated substrates. Europium complex, Europium tris(2-thenoyltrifluoroacetonato)(2,2'-bipyridine), was then incorporated to the substrates via coordination reaction. The surface chemical composition and surface morphology of modified substrates were investigated by X-ray photoelectron spectroscopy and atomic force microscopy, respectively. The electrochemical characterization, fluorescence microscopy and photoluminescence analysis were utilized to confirm the Europium complex formation on the substrates.
机译:提出了一种通过与有机硅烷接枝将发光稀土配合物引入Si和铟锡氧化物衬底的方法。有机硅烷3-氨基丙基三乙氧基硅烷用作分子桥,以将5-(7-溴庚基)-5'-甲基-2,2'-联吡啶连接到活化的底物上。然后,通过配位反应将complex络合物三(2-thenoyltrifluoroacetonato)(2,2'-联吡啶)掺入基质中。用X射线光电子能谱和原子力显微镜分别研究了改性基体的表面化学组成和表面形貌。电化学表征,荧光显微镜和光致发光分析用于确认confirm络合物在底物上的形成。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号