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Effect of stage control parameters on the FIB milling process

机译:阶段控制参数对FIB铣削过程的影响

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摘要

The extended application of focused ion beam (FIB) technology is dependent on the complicated reciprocal relation of operating parameters, which influence the FIB processes. Undesired surface damage by the FIB milling process must be reduced for successful and efficient modifications on the surface of a silicon substrate. In general, the dwell time, the beam irradiated pixel spacing, and the pattern size were considered as the stage control parameters during the milling process. In order to reduce the surface damage, the influence of the parameters on FIB milling process was examined with respect to the dimensions of the milled pattern.
机译:聚焦离子束(FIB)技术的扩展应用取决于操作参数的复杂倒数关系,这会影响FIB过程。为了成功而有效地对硅衬底表面进行修饰,必须减少FIB铣削过程对表面的不良影响。通常,在铣削过程中,将停留时间,光束照射的像素间距和图案尺寸视为平台控制参数。为了减少表面损伤,相对于研磨图案的尺寸,检查了参数对FIB研磨工艺的影响。

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