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A multilayer model for describing hardness variations of aged porous silicon low-dielectric-constant thin films

机译:用于描述老化的多孔硅低介电常数薄膜硬度变化的多层模型

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摘要

This paper reports on the micro-instrumented indentation of a porous silicon structure obtained by anodization of a highly p~+-doped (100) silicon substrate aged over 1 week. The three-layer structure obtained consists of oxidized porous silicon (cap-layer), porous silicon (inner-layer) and silicon substrate. The hardness curve has the typical "U shape" of low-dielectric-constant films when the indentation depth rises: the early decrease in hardness, due to the soft inner layer, is followed by an increase, due to the hard substrate. A multilayer model is developed to account for hardness variation with respect to the applied load. This model considers the crumbling of the cap-layer and of the inner porous structure. As a result, it is shown that considering the minima in the U shape gives an over-estimated value when it comes to assessing the coating hardness. In our experiment, this minimum depends on both the hardness and the thickness of the oxidized cap layer, but not on the mechanical properties of the substrate, even for indentation depths slightly lower than the film's thickness.
机译:本文报道了通过对1个星期以上的高p〜+掺杂(100)硅衬底进行阳极氧化而获得的多孔硅结构的微仪器压痕。所获得的三层结构由氧化的多孔硅(盖层),多孔硅(内层)和硅衬底组成。当压痕深度增加时,硬度曲线具有低介电常数薄膜的典型“ U形”:由于软内层而导致的早期硬度下降,由于硬质基底而导致的硬度上升。开发了多层模型以考虑相对于所施加载荷的硬度变化。该模型考虑了盖层和内部多孔结构的破裂。结果表明,在评估涂层硬度时,考虑U形的最小值会产生高估值。在我们的实验中,即使压痕深度略小于薄膜的厚度,该最小值也取决于氧化盖层的硬度和厚度,而不取决于基材的机械性能。

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  • 来源
    《Thin Solid Films 》 |2009年第1期| 213-221| 共9页
  • 作者单位

    Unite de Recherche Materiaux et Energies Renouvelables URMER, Universite Abou Bakr Belkaid, BP 119, Tlemcen 13000, Algerie;

    Arts et Metiers ParisTech, CNRS, LMPGM, Equipe Caracterisation et Proprietes de la Perisurface, 8 boulevard Louis XIV 59046 Lille Cedex, France;

    LARMAUR, EA 410, Universite de Rennes 1, Campus de Beaulieu, 35042 Rennes cedex, France;

    Arts et Metiers ParisTech, CNRS, LMPGM, Equipe Caracterisation et Proprietes de la Perisurface, 8 boulevard Louis XIV 59046 Lille Cedex, France;

    Unite de Recherche Materiaux et Energies Renouvelables URMER, Universite Abou Bakr Belkaid, BP 119, Tlemcen 13000, Algerie;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    instrumented-indentation testing; composite hardness modelling; porous si film; low-k dielectric thin film; martens hardness;

    机译:压痕测试;复合硬度建模;多孔硅膜低介电常数薄膜马氏硬度;

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