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机译:用于闪存设备中低k / Cu互连的基于低k膜的耐CO化学腐蚀灰化工艺
Semiconductor R&D Center, Samsung Electronics, Hwasung City, Republic of Korea School of Information and Communication Engineering, Sungkyunkwan University, 300, Chunchun-dong, Jangan-gu, Suwon, Kyunggi-do, 440-746, Republic of Korea;
Semiconductor R&D Center, Samsung Electronics, Hwasung City, Republic of Korea;
Semiconductor R&D Center, Samsung Electronics, Hwasung City, Republic of Korea;
Semiconductor R&D Center, Samsung Electronics, Hwasung City, Republic of Korea;
Semiconductor R&D Center, Samsung Electronics, Hwasung City, Republic of Korea;
School of Information and Communication Engineering, Sungkyunkwan University, 300, Chunchun-dong, Jangan-gu, Suwon, Kyunggi-do, 440-746, Republic of Korea;
low-k; dielectric damage; cu interconnection; ash process; CO chemistry;
机译:用于进一步缩小超大型集成器件-Cu互连的等离子增强化学气相沉积SiCH膜的低k覆盖层的材料设计
机译:C_4F_8气体对Cu / low-k互连的甲基BCN膜的干法刻蚀性能
机译:Cu / Low-k器件的CMP后净化处理的开发
机译:多孔低k膜的纳米结构的新方面及其对65 nm及以上TEM的Cu / Low-k工艺的影响说明了什么?
机译:电迁移增强了无铅焊点中铜-锡金属间化合物的动力学,并使用分步和闪光压印光刻技术进行了铜低k双大马士革工艺。
机译:用于进一步缩小超大型集成器件-Cu互连的等离子增强化学气相沉积SiCH膜的低k覆盖层的材料设计
机译:利用角度分辨光散射在IC器件上的Cu / Low-K互连上具有角度分辨光散射的低k电介质的拉曼信号的增强