机译:基于低温凝固的低温生物传感器包装
Electronic Science Department, Kurukshetra University, Kuruk- shetra, Haryana (India), PIN-136119,Central Electronics Engineering Research Institute (CEER1)/Council of Scientific and Industrial Research (CSIR), Pilani-333031, Rajasthan, India;
rnCentral Electronics Engineering Research Institute (CEER1)/Council of Scientific and Industrial Research (CSIR), Pilani-333031, Rajasthan, India;
rnHybrid Microcircuits Group, CEERI/CSIR, Pilani, Rajasthan (India), PIN-333031;
thick film au; bi-in alloy; thermal stability; scanning electron microscopy (SEM); Ph resistivity;
机译:GH3039对高温应用GH3039的低温加入,AU-Si等温凝固
机译:用AU-Si等温凝固的NITI形状记忆合金低温连接
机译:低于共晶温度的冷等温表面上二元溶液凝固的半精确溶液
机译:Al / Mg2Si金属基复合材料与AZ91D的低温-部分瞬态液相键合过程中的等温凝固动力学
机译:高温气冷堆等温和非等温湍流的大涡模拟。
机译:使用多重逆转录回报介导的等温扩增与基于金纳米粒子的侧向流动生物传感器连接的多重逆转录环介导的等温扩增的快速和视觉检测
机译:环介导的等温扩增测定与基于纳米粒子的侧向流动体传感器组合的,用于快速检测质粒介导的Colistin抗性基因MCR-1
机译:常规铸造,定向凝固和单晶形式的镍基高温合金的高温低周疲劳