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Deposition of fluorine doped mdium oxide by atmospheric pressure chemical vapour deposition

机译:大气压化学气相沉积法沉积氟掺杂的氧化钛

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摘要

We report the deposition of fluorine doped indium oxide by atmospheric pressure chemical vapour deposition (APCVD) using a previously unreported precursor combination; dimethylindium acetylacetonate, [Me_2ln(acac)] and trifluoroacetic acid (TFA). This process is potentially scalable for high throughput, large area production. [Me_2In(acac)] is a volatile solid. It is more stable and easier to handle than traditional indium oxide precursors such as pyrophoric trialkylindium compounds. Cubic fluorine doped indium oxide (F.In_2O_3) was deposited at a substrate temperature of 550 ℃ with growth rates exceeding 8 nm/s. Resistivity was 8 × 10 ~(-4) Ω cm and transmission for a 200 nm film was > 80% with less than l%haze.
机译:我们报告了使用以前未报道的前体组合通过大气压化学气相沉积(APCVD)沉积的氟掺杂的氧化铟;乙酰丙酮二甲基铟,[Me_2ln(acac)]和三氟乙酸(TFA)。对于高通量,大面积生产,该过程可能具有可扩展性。 [Me_2In(acac)]是挥发性固体。它比传统的氧化铟前体(如发火性三烷基铟化合物)更稳定且更易于处理。在550℃的衬底温度下沉积了立方氟掺杂的氧化铟(F.In_2O_3),生长速率超过8 nm / s。电阻率为8×10〜(-4)Ωcm,200 nm薄膜的透射率> 80%,雾度小于1%。

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