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Growth and characterization of electrodeposited Cu(In,Al)Se_2 thin films

机译:电沉积Cu(In,Al)Se_2薄膜的生长与表征

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Thin films of Culn(1-x)Al_xSe_2 were grown using a cathodic electrodeposition technique. The Culn(1-x)Al_xSe_2 films were electrodeposited on SnO_2 coated glass from aqueous baths containing different Al contents using deposition potentials ranging from - 650 mV to - 850 mV versus a saturated calomel electrode. The electrodeposited films were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive analysis of X-rays, atomic force microscopy, and UV-VIS-NIR spectroscopy. The results show that single phase Culn(1-x)Al_xSe_2 films with Al content x around 0.27-0.33 having good stoichiometry can be produced in the above potential range. XRD and SEM studies show that films deposited at -650 mV and - 750 mV have good crystallinity while those grown at - 850 mV have comparatively poorer crystallinity. SEM studies show that the particle size of the films grown at - 650 and - 750 mV is in the micron range but is around 100 nm when grown at - 850 mV. Optical studies show that the optical band gap shifts with Al content from 1.21 eV for x = 0.27 to about 1.42 eV for x = 0.33. The as-grown as well as vacuum annealed films were n-type in conductivity with resistivity in the range 3-5 x 10~-3 Ωcm.
机译:使用阴极电沉积技术生长Culn(1-x)Al_xSe_2薄膜。使用相对于饱和甘汞电极的沉积电位范围为-650 mV至-850 mV的沉积电势,从包含不同Al含量的水浴中,将Culn(1-x)Al_xSe_2薄膜电沉积在SnO_2涂层玻璃上。使用X射线衍射(XRD),扫描电子显微镜(SEM),X射线的能量色散分析,原子力显微镜和UV-VIS-NIR光谱对电沉积膜进行表征。结果表明,在上述电位范围内,可以生产具有良好的化学计量比的Al含量x在0.27-0.33左右的单相Culn(1-x)Al_xSe_2膜。 XRD和SEM研究表明,在-650 mV和-750 mV处沉积的薄膜具有良好的结晶度,而在-850 mV处生长的薄膜具有相对较差的结晶度。 SEM研究表明,在-650和-750 mV下生长的薄膜的颗粒尺寸在微米范围内,而在-850 mV下生长时的薄膜尺寸在100 nm左右。光学研究表明,随着Al含量的增加,光学带隙从x = 0.27的1.21 eV变为x = 0.33的约1.42 eV。刚生长的薄膜和真空退火的薄膜的电导率均为n型,电阻率范围为3-5 x 10〜-3Ωcm。

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