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Growth and in-situ electrical characterization of ultrathin epitaxial TiN films on MgO

机译:MgO上超薄外延TiN薄膜的生长和原位电学表征

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摘要

We examine the properties of ultrathin TiN films grown by reactive dc magnetron sputtering on single-crystalline MgO( 100) substrates at growth temperatures ranging from 30 to 650 ℃. The resistance of the films is measured in-situ, during growth, to study the thickness at which the films coalesce and become structurally continuous. Both the in-situ resistance measurements and X-ray diffraction measurements show a clear transition from polycrystalline growth to epitaxial (100) growth well below typical TiN growth temperatures, or between 100 and 200 ℃. The coalescence and continuity thicknesses are 1.09 ± 0.06 nm and 5.5 ±0.5 nm, respectively, at room temperature but reach a minimum of 0.08 ± 0.02 nm and 0.7 ±0.1 nm, respectively, at 600 ℃. A large drop in resistivity is seen with increasing growth temperature and the resistivity reaches 16.6μΩcm at 600 ℃. Achieving epitaxy at such a low temperature and a low continuity thickness is important in a variety of applications such as device interconnects and metal-oxide-semiconductor devices.
机译:我们研究了在反应温度为30到650℃的单晶MgO(100)衬底上通过反应性直流磁控溅射法生长的TiN薄膜的特性。在生长期间就地测量薄膜的电阻,以研究薄膜聚结并在结构上连续的厚度。原位电阻测量和X射线衍射测量均显示出从多晶生长到远低于典型TiN生长温度或100到200℃之间的外延(100)生长的明显过渡。室温下的聚结和连续厚度分别为1.09±0.06 nm和5.5±0.5 nm,但在600℃时分别达到0.08±0.02 nm和0.7±0.1 nm的最小值。随着生长温度的升高,电阻率下降很大,在600℃时电阻率达到16.6μΩcm。在如此低的温度和低的连续厚度下实现外延在诸如器件互连和金属氧化物半导体器件的各种应用中很重要。

著录项

  • 来源
    《Thin Solid Films》 |2011年第18期|p.5861-5867|共7页
  • 作者单位

    Science Institute, University of Iceland, Dunhaga 3, IS-107 Reykjavik, Iceland;

    Science Institute, University of Iceland, Dunhaga 3, IS-107 Reykjavik, Iceland;

    Science Institute, University of Iceland, Dunhaga 3, IS-107 Reykjavik, Iceland;

    Science Institute, University of Iceland, Dunhaga 3, IS-107 Reykjavik, Iceland ,Department of Electrical and Computer Engineering, University of Iceland, Hjardarhaga 2-6, IS-107 Reykjavik, Iceland;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    in-situ resistivity; thin film; titanium nitride; magnetron sputtering;

    机译:原位电阻率薄膜氮化钛磁控溅射;

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