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Electrical responses of chalcogenide films in the photodoping process

机译:硫族化物薄膜在光掺杂过程中的电响应

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The photodoping process in Al/AsS_2/Ag tri-layer films has been studied through measurements of electrical impedance, photodoped-layer thickness, and photocurrent. Frequency dependence of the impedance suggests that the sample under photodoping can be approximated by an equivalent electrical circuit. A thickness of photodoped layers, which is estimated from the impedance, is in agreement with a geometrical thickness measured by an atomic force microscope for chemically etched samples. Under the photodoping (with zero bias voltages), a photocurrent remains constant at ~ 5 pA, and near the completion it increases to ~1 nA, which is followed with a gradual decrease. By applying a bias voltage between the top (semi-transparent Al) and bottom (Ag) electrodes, we can change a photodoping rate by an order. This rate change is attributable to the modulation of an effective electric field in the doped layer, which induces the motion of Ag ions.
机译:通过测量电阻抗,光掺杂层厚度和光电流,研究了Al / AsS_2 / Ag三层膜中的光掺杂过程。阻抗的频率依赖性表明,光掺杂下的样品可以用等效电路近似。由阻抗估计的光掺杂层的厚度与通过原子力显微镜对化学蚀刻样品测得的几何厚度一致。在光掺杂(零偏置电压)下,光电流保持恒定在〜5 pA,并且在接近完成时,光电流增加到〜1 nA,然后逐渐减小。通过在顶部(半透明的Al)电极和底部(Ag)电极之间施加偏置电压,我们可以按顺序改变光掺杂速率。该速率变化归因于对掺杂层中有效电场的调制,该电场引起Ag离子的运动。

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