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Formation of CoN_x ultra-thin films during direct-current nitrogen ion sputtering in ultrahigh vacuum

机译:超高真空直流氮离子溅射过程中CoN_x超薄膜的形成

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摘要

This study reports the formation of ultra-thin cobalt nitride (CoN_x) films on a Co/ZnO(002) crystal by low-energy ion sputtering of nitrogen in an ultrahigh vacuum system. The CoN_x film formed during ion bombardment in which the nitrogen plasma (N~+) results in both sputtering and implantation in the formation process of CoN_x, especially for the Co adsorbed layers. Auger electron spectroscopy analysis shows that the composition ratio x as a function of sputtering time was highly related to the N~+ ion energy that was varied from 0.5 to 2 keV. The composition ratio x of CoN_x films is inversely proportional to the ion energy. Low-energy ion sputtering is possible to fabricate ultra-thin CoN_x films and to adjust their chemical compositions.
机译:这项研究报告了在超高真空系统中通过低能氮离子溅射在Co / ZnO(002)晶体上形成超薄氮化钴(CoN_x)膜。在离子轰击过程中形成的CoN_x膜,其中氮等离子体(N〜+)在CoN_x的形成过程中导致溅射和注入,特别是对于Co吸附层。俄歇电子能谱分析表明,作为溅射时间的函数的组成比x与N〜+离子能量(从0.5到2 keV变化)高度相关。 CoN_x膜的组成比x与离子能量成反比。低能离子溅射可以制造超薄CoN_x膜并调节其化学成分。

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