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机译:铜基板上无铅回流焊接的临界氧化物厚度
Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan Assembly Test Global Materials, Intel Microelectronics Asia Ltd, BJ, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan;
Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan;
Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan;
Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan;
oxidation; soldering; thin films; wetting; metal oxide; organic solderable preservative; copper oxide;
机译:NiO纳米粒子回流焊后无铅Sn-3.0Ag-0.5Cu锡膏的组织和力学性能
机译:在铜上多次无铅焊料回流期间抑制铜的消耗
机译:回流过程中铜基板表面氧化物和加热速率对Sn-3.5Ag焊料熔点的影响
机译:回流焊接过程中Sn-0.7Cu焊料和Cu衬底之间的界面反应和IMC的形成
机译:表面安装气相回流焊接中的焊锡芯吸
机译:多重回流对Sn-0.5Cu-Al(Si)焊料和Cu基质的界面反应和力学性能的影响
机译:多重回流对Sn-0.5Cu-Al(Si)焊料和Cu基质的界面反应和力学性能的影响
机译:开发新的无铅焊料:sn-ag-Cu