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Amorphous structure and electrical performance of low-temperature annealed amorphous indium zinc oxide transparent thin film transistors

机译:低温退火非晶氧化铟锌透明薄膜晶体管的非晶结构和电性能

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摘要

The effect of low-temperature (200 ℃) annealing on the threshold voltage, carrier density, and interface defect density of amorphous indium zinc oxide (a-IZO) thin film transistors (TFTs) is reported. Transmission electron microscopy and x-ray diffraction analysis show that the amorphous structure is retained after 1 h at 200 ℃ The TFTs fabricated from as-deposited IZO operate in the depletion mode with on-off ratio of >10~6, sub-threshold slope (S) of -1.5 V/decade, field effect mobility (μ_(FE)) of 18±1.6cm~2/Vs, and threshold voltage (V_(Th)) of - 3 ± 0.7 V. Low-temperature annealing at 200 ℃ in air improves the on-current, decreases the sub-threshold slope (1.56 vs. 1.18 V/decade}, and increases the field effect mobility (μ_(FE)) from 18.2 to 23.3 cm~2/Vs but also results in a V-n, shift of-15 ± 1.1 V. The carrier density in the channel of the as-deposited (4.3 × 10~(16) /cm~3) and annealed at 200 ℃ (8.1 × 10~(17) /cm~3) devices were estimated from test-TFT structures using the transmission line measurement methods to find channel resistivity at zero gate voltage and the TFT structures to estimate carrier mobility.
机译:报道了低温(200℃)退火对非晶铟锌氧化物(a-IZO)薄膜晶体管(TFT)的阈值电压,载流子密度和界面缺陷密度的影响。透射电子显微镜和X射线衍射分析表明,在200℃下放置1 h后,非晶态结构得以保留。由沉积的IZO制成的TFT以耗尽模式工作,开/关比> 10〜6,亚阈值斜率(S)为-1.5 V /十倍,场效应迁移率(μ_(FE))为18±1.6cm〜2 / Vs,阈值电压(V_(Th))为-3±0.7 V.低温退火空气中200℃改善了导通电流,减小了亚阈值斜率(1.56对1.18 V /十倍},并使场效应迁移率(μ_(FE))从18.2 cm〜2 / Vs增加到23.3 cm〜2 / Vs。在Vn中移动-15±1.1V。沉积后的沟道中的载流子密度(4.3×10〜(16)/ cm〜3)并在200℃退火(8.1×10〜(17)/使用传输线测量方法从测试TFT结构估算cm_3)器件,以找到零栅极电压下的沟道电阻率,并通过TFT结构估算载流子迁移率。

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