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Thermal stability of carrier centers in various types of transparent conductive ZnO and Ga-doped ZnO films

机译:各种类型的透明导电ZnO和Ga掺杂的ZnO薄膜中载流子中心的热稳定性

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We investigated the thermal stability of the transparent conductive properties of undoped ZnO and Ga-doped ZnO (GZO) films when they were annealed in a high vacuum with stepwise increasing temperature. The ZnO samples included V_o-rich and Zn-rich ZnO films; the primary donors were respectively oxygen vacancies (V_o) or Zn atoms highly unsaturated with O_xygen atoms. V_o-rich ZnO was the most unstable against annealing; resistivity initially within the 10~(-3) Ω cm range diverged higher than 10 Ω, cm when a critical temperature was exceeded. The critical temperature between 350 and 450 ℃ depended on the film thickness, which indicated that V_o's were diminished through recombination with migrating interstitial oxygen atoms. In contrast, Zn-rich ZnO films remained highly conductive up to 550 ℃. They became more and more transparent and their crystallinity improved at higher annealing temperatures, which was the consequence of metallic-like Zn atoms being removed through desorption from the surface or being accommodated into the crystalline lattice. Comparatively, GZO films were more robust against annealing with their resistivities remaining unchanged up to 350 ℃.
机译:我们研究了无掺杂ZnO和掺杂Ga的ZnO(GZO)薄膜在高真空中逐步升高温度进行退火时的透明导电特性的热稳定性。 ZnO样品包括富V_o和富锌的ZnO薄膜。主要的供体分别是氧空位(V_o)或氧原子高度不饱和的Zn原子。富V_o的ZnO对退火最不稳定;当超过临界温度时,电阻率最初在10〜(-3)Ωcm范围内发散,高于10Ωcm。 350-450℃之间的临界温度取决于薄膜的厚度,这表明V_o's通过与迁移的间隙氧原子重组而降低。相反,富锌的ZnO薄膜在550℃时仍保持高导电性。它们变得越来越透明,并且在较高的退火温度下其结晶度得到了改善,这是由于金属状的Zn原子通过从表面解吸而除去或被容纳在晶格中的结果。相比之下,GZO膜对退火的抵抗力更强,其电阻率在350℃时保持不变。

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