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Front and backside-illuminated GaN/Si based metal-semiconductor-metal ultraviolet photodetectors manufactured using micromachining and nano-lithographic technologies

机译:使用微加工和纳米光刻技术制造的正面和背面照明的GaN / Si基金属-半导体-金属紫外光电探测器

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摘要

This paper presents the fabrication and characterization of GaN/Si based Ultraviolet (UV) Metal/Semiconductor/ Metal (MSM) photodetectors. The thin GaN membranes have been obtained by semiconductor micromachining techniques. The two MSM interdigitated structures are contrived of fingers and interdigit spacings 100 and 200 nm wide respectively, obtained by nanolithographic techniques on GaN. Responsivity measurements were performed using both front side as well as backside-illumination. For front side illumination and for a wavelength of 365 nm and 2.5 V bias the structure with 100 nm wide fingers/interdigit spacing, exhibited the high value of 1.45 A/W. Backside-illumination responsivity of the same structure was -0.37 A/W at the same wavelength and bias. Backside-illuminated photodetctors are interesting in two dimensional UV CCD imaging array manufacturing.
机译:本文介绍了基于GaN / Si的紫外线(UV)金属/半导体/金属(MSM)光电探测器的制造和特性。 GaN薄膜已经通过半导体微加工技术获得。这两个MSM叉指结构分别是指通过GaN上的纳米光刻技术获得的手指和叉指间距分别为100和200 nm宽。使用正面和背面照明均进行了响应度测量。对于正面照明以及365 nm和2.5 V的波长偏置,手指/指间间距为100 nm宽的结构显示1.45 A / W的高值。在相同的波长和偏置下,相同结构的背面照明响应率为-0.37 A / W。在二维UV CCD成像阵列制造中,背面照明的光电探测器很有趣。

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