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机译:缩小以Au / Cr自组装簇为蚀刻掩模通过反应离子蚀刻制造的硅纳米柱的横向尺寸
Kaunas University of Technology, Panevezys Institute, Department of Physical Sciences, Daukanto 12, LT-35212, Panevezys, Lithuania;
Departments of Chemistry and Chemical and Biochemical Engineering, 85 Eckstein Medical Research Building, University of Iowa, Iowa City, IA 52242, USA;
Kaunas University of Technology, Panevezys Institute, Department of Electrical Engineering, Daukanto 12, LT-35212, Panevezys, Lithuania;
Panevezys Mechatronics Center, Laboratory of Micro and Nano Technologies, Pilenti 30, Lithuania;
Kaunas University of Technology, Panevezys Institute, Department of Electrical Engineering, Daukanto 12, LT-35212, Panevezys, Lithuania;
nanopillars; reactive ion etching; cold; chromium; thin films;
机译:使用SF_6 / N_2气体混合物最大化反应离子蚀刻(RIE)参数的优化,以最大化硅的横向蚀刻速率:用Au部件蚀刻MEMS中的Si替换Si
机译:使用反应离子刻蚀滞后和牺牲氧化技术在体硅中高纵横比结构的单掩模三维微加工
机译:基于深反应离子刻蚀的硅高级刻蚀,用于硅高纵横比微结构和三维微纳结构
机译:SiO_2膜上的自组装Ni纳米点-用于在Si衬底上形成Si纳米柱的新型反应离子刻蚀掩模
机译:电感耦合等离子体刻蚀反应器中离子流和硅刻蚀速率的二维均匀性
机译:基于Au掩模和反应性离子刻蚀的晶圆级分层纳米柱阵列用于有效的3D SERS基板
机译:采用自对准双向电化学刻蚀法制备的硅三维光子晶体结构对硅纳米晶的自发发射控制
机译:具有极低掩模材料蚀刻速率的硅的反应溅射蚀刻