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Analysis of crystal defects on GaN-based semiconductors with advanced scanning probe microscope techniques

机译:使用先进的扫描探针显微镜技术分析GaN基半导体上的晶体缺陷

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摘要

The correlation of surface pits with leakage currents in gallium nitride (GaN) films are studied with scanning probe microscopy (SPM) techniques. The analyses were performed at both single n-GaN films grown on free-standing GaN and completely processed GaN light-emitting diode (LED) structures on sapphire substrates both grown by metal organic chemical vapor phase epitaxy. Topographical SPM images acquired with ultra-sharp probes were superimposed with current maps obtained by conductive atomic force microscopy (CAFM). The applicability of two different modifications of CAFM techniques has been studied. For both sample types, CAFM has revealed a clear correlation between forward-bias leakage current and locations of surface pits. In case of the LED structure, additional local current-voltage characteristics show that enhanced current conduction occurs in both forward and reverse bias on surface pit positions.
机译:使用扫描探针显微镜(SPM)技术研究了氮化镓(GaN)膜中表面凹坑与泄漏电流的相关性。对在自立式GaN上生长的单个n-GaN膜和在蓝宝石衬底上均通过金属有机化学气相外延生长的经过完全处理的GaN发光二极管(LED)结构进行了分析。用超锐利探针获取的地形SPM图像与通过导电原子力显微镜(CAFM)获得的电流图叠加。已经研究了CAFM技术的两种不同修改的适用性。对于这两种样品,CAFM都揭示了正向偏置泄漏电流与表面凹坑位置之间的明显关联。在LED结构的情况下,附加的局部电流-电压特性表明,在表面凹坑位置上的正向和反向偏压中均发生增强的电流传导。

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