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Doping and electrical properties of cubic boron nitride thin films: A critical review

机译:立方氮化硼薄膜的掺杂和电性能:关键评论

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摘要

Cubic boron nitride (c-BN) is a promising material for high-power and high-temperature electronic devices operating in harsh environments due to its outstanding properties including a wide band-gap, good chemical stability, high thermal conductivity, and high breakdown field. The electronic applications of c-BN have received considerable attention, benefiting from the progress in c-BN thin film deposition techniques during the last few years. The present article reviews the latest developments in doping and electrical properties of c-BN thin films. Following a brief introduction on film growth, we present calculated theoretical results on electronic structure as well as the energies of native defects and impurity dopants in c-BN. In recent experimental research, several dopants, including Be, Mg, Zn, S, and Si, have been incorporated into c-BN thin films during deposition or by post ion implantation, resulting in both n- and p-type conduction. These results are summarized and discussed in Section 3. In addition, results on c-BN/metal-contacts and p-n junctions based on intrinsic or doped c-BN thin films are discussed in Section 4. Finally, current status and future prospects for doping and electrical properties of c-BN thin films are discussed.
机译:立方氮化硼(c-BN)具有出色的性能,包括宽禁带,良好的化学稳定性,高导热性和高击穿场强,是在恶劣环境下工作的大功率高温电子设备的有前途的材料。得益于最近几年c-BN薄膜沉积技术的进步,c-BN的电子应用受到了广泛的关注。本文回顾了c-BN薄膜的掺杂和电学性质的最新进展。在简要介绍了薄膜生长之后,我们介绍了有关电子结构以及c-BN中天然缺陷和杂质掺杂剂的能量的理论计算结果。在最近的实验研究中,在沉积过程中或通过离子注入后,几种掺杂剂(包括Be,Mg,Zn,S和Si)已掺入c-BN薄膜中,从而导致n型和p型导电。这些结果在第3节中进行了总结和讨论。此外,在第4节中讨论了基于本征或掺杂c-BN薄膜的c-BN /金属接触和pn结的结果。最后,掺杂的现状和未来展望讨论了c-BN薄膜的电学性质。

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