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Phenomena of n-type metal-oxide-semiconductor-field-effect-transistors with contact etch stop layer stressor for different channel lengths

机译:不同沟道长度的带有接触蚀刻停止层应力源的n型金属氧化物半导体场效应晶体管的现象

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摘要

In this paper, n-type metal-oxide-semiconductor-field-effect-transistors (nMOSFETs) combining contact etch stop layer (CESL), SiGe channel, and Si-cap have been fabricated. The simulation results and electrical properties have also been investigated and indicated that the CESL type (tensile or compressive) or channel length (short or long) has a significant effect on the stress distribution of the channel. This is important because the stress in the channel region affects the carrier mobility and therefore the device performance. In order to verify the simulation results, the electrical properties such as mobility and output characteristics have been measured. According to the output characteristics, as channel length is 0.11 μm, the tensile CESL can enhance the performance of nMOSFETs. However, the improved trend is inverted when the channel length increases. On the other hand, we have also compared the threshold voltage (Vt) roll-off and subthreshold swing (SS) for different structures. The results show that the devices exhibit a worse Vt roll-off when CESL is adopted and SS degrades more when compressive stress is induced in the channel.
机译:在本文中,已制造出结合了接触蚀刻停止层(CESL),SiGe沟道和Si-cap的n型金属氧化物半导体场效应晶体管(nMOSFET)。仿真结果和电性能也得到了研究,表明CESL类型(拉伸或压缩)或通道长度(短或长)对通道的应力分布有显着影响。这很重要,因为沟道区域中的应力会影响载流子迁移率,进而影响器件性能。为了验证仿真结果,已测量了电性能,例如迁移率和输出特性。根据输出特性,当沟道长度为0.11μm时,抗拉CESL可以增强nMOSFET的性能。但是,当通道长度增加时,改善的趋势就会倒转。另一方面,我们还比较了不同结构的阈值电压(Vt)滚降和亚阈值摆幅(SS)。结果表明,采用CESL时,器件表现出更差的Vt滚降;当在通道中引起压应力时,SS降解更大。

著录项

  • 来源
    《Thin Solid Films》 |2013年第1期|120-124|共5页
  • 作者单位

    Institute of Mechatronic Engineering, National Taipei University of Technology, 1 Sec. 3, Zhongxiao E. Rd., Taipei 106 Taiwan, ROC;

    Department of Electronic Engineering, Ming-Oman University, 5 De Ming Rd., Gui Shan, Taoyuan 333 Taiwan, ROC;

    Department of Mechanical Engineering, Chung Yuan Christian University, 200, Chung Pei Rd., Chung Li, Taoyuan 320 Taiwan, ROC;

    Department of Mechatronic Technology, National Taiwan Normal University, 162, Sec. 1, Heping E Rd., Taipei 106 Taiwan, ROC;

    Institute of Mechatronic Engineering, National Taipei University of Technology, 1 Sec. 3, Zhongxiao E. Rd., Taipei 106 Taiwan, ROC;

    Institute of Mechatronic Engineering, National Taipei University of Technology, 1 Sec. 3, Zhongxiao E. Rd., Taipei 106 Taiwan, ROC;

    Institute of Mechatronic Engineering, National Taipei University of Technology, 1 Sec. 3, Zhongxiao E. Rd., Taipei 106 Taiwan, ROC;

    Department of Mechatronic Technology, National Taiwan Normal University, 162, Sec. 1, Heping E Rd., Taipei 106 Taiwan, ROC;

    Department of Mechatronic Technology, National Taiwan Normal University, 162, Sec. 1, Heping E Rd., Taipei 106 Taiwan, ROC;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Strained-Si technology; Contact etch stop layer (CESL); SiGe channel; Stress simulation;

    机译:应变硅技术;接触蚀刻停止层(CESL);SiGe通道;压力模拟;

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