Field-emission transmission electron microscopy study of the reaction sequence between Sn-Ag-Cu alloy and an amorphous Pd(P) thin film in microelectronic packaging

摘要

The reaction sequence between liquid Sn-3Ag-0.5Cu solder and solid Au/Pd(P)/electrolytic-Ni films was carefully examined using a field-emission transmission electron microscope at different exposure times (15 s, 30 s, and 120 s). After 15 s of exposure, the uppermost layer of Au was removed from the interface and a portion of the Pd(P) film remained. At this stage of the reaction, the predominant products were PdSn_3 and Pd_3P. After 30 s of exposure, Pd(P) was completely exhausted, and three additional intermetallic species, including Pd-Sn-P, Pd_6P, and Pd_(15)P_2, nucleated. After 120 s of exposure, the aforementioned species were destroyed, and Cu and Ni were involved in the reaction. The predominant product became (Cu,Ni)_6Sn_5, and the nucleation of a nanocrystalline Ni_2SnP layer in the middle of (Cu,Ni)_6Sn_5 resulted. These results suggest that Pd and P play a vital role in the early stage of soldering reaction, even though the Pd(P) film is only a few submicrons thick and its P content is quite low (2-5%).