机译:热处理对含成孔剂和无成孔剂的超低k电介质的物理,电性能和可靠性的影响
Department of Material Science and Engineering, National Chiao-Tung University, Shin-Chu, Taiwan, ROC;
Department of Electrical Engineering, National Chi-Nan University, Nan-Tou, Taiwan, ROC;
Department of Electrical Engineering, National Chi-Nan University, Nan-Tou, Taiwan, ROC;
Department of Material Science and Engineering, National Chiao-Tung University, Shin-Chu, Taiwan, ROC;
Department of Electrical Engineering, National Chi-Nan University, Nan-Tou, Taiwan, ROC;
low-k dielectric; porogen; UV curing; reliability; breakdown; TDDB;
机译:溶胶-凝胶法热处理和pH对NdAlO3介电薄膜电学和物理性能的影响
机译:硅基硅基锗衬底上热氧化电介质的物理和电学性质
机译:MIMC的可靠性和电性能由电介质的物理层属性定义
机译:由电介质的物理层属性定义的MIMC可靠性和电性能
机译:电和热感应物理缺陷对AlGaN / GaN高电子迁移率晶体管的可靠性的影响。
机译:CF4等离子体处理HfO2栅电介质的非晶铟镓锌氧化物薄膜晶体管的电性能和可靠性提高
机译:超级-K纳米电容器中可收回的电击穿强度和介电常数
机译:通过隧道势垒和薄介电层的电传输和高Tc氧化物超导体的物理性质。