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首页> 外文期刊>Thin Solid Films >High-temperature isothermal capacitance transient spectroscopy study on SiN deposition damages for low-Mg-doped p-GaN Schottky diodes
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High-temperature isothermal capacitance transient spectroscopy study on SiN deposition damages for low-Mg-doped p-GaN Schottky diodes

机译:低镁掺杂的p-GaN肖特基二极管的SiN沉积损伤的高温等温电容瞬态光谱研究

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摘要

Attempt to achieve a surface passivation of p-type GaN was conducted on low-Mg-doped p-GaN by employing SiN films depositions by an Ar-plasma-sputtering and a plasma-enhancement chemical vapor deposition. Process induced damages were then characterized by using a high-temperature isothermal capacitance transient spec-troscopy. A large single peak, likely attributed to acceptor-type surface states, was detected in the as-grown samples. The energy level was measured to be 1.18 eV above the valence band edge, which is close to a Ga-vacancy (V_(Ga)) reported elsewhere. It was suggested that a small portion of Ga atoms were missing from the surface, and a large density of V_(Ga) were created in a few surface layers. The peak intensity was found to significantly decrease by the SiN depositions, irrespective of the deposition methods, and further decreases upon annealing at 800 ℃. After the SiN deposition and the annealing, the peak intensity decreased: the pure Ga vacancies may transform into complex defects in the course of the SiN deposition and annealing. These results show that the present characterization method with the low-Mg-doped p-GaN Schottky contacts is effective and serves as sensitive characterization of the surface defects.
机译:通过采用通过等离子溅射和等离子体增强化学气相沉积的SiN膜沉积,在低Mg掺杂的p-GaN上进行了实现p型GaN的表面钝化的尝试。然后,通过使用高温等温电容瞬态光谱法对过程引起的损坏进行表征。在生长的样品中检测到一个大的单峰,可能归因于受体型表面状态。经测量,该能级为价带边缘之上的1.18 eV,接近于其他地方报道的Ga空位(V_(Ga))。这表明表面上缺少一小部分Ga原子,并且在一些表面层中产生了大密度的V_(Ga)。无论采用哪种沉积方法,发现峰值强度都会因SiN沉积而显着降低,而在800℃退火时,峰值强度会进一步降低。经过SiN沉积和退火后,峰值强度降低:在SiN沉积和退火过程中,纯的Ga空位可能转变为复杂的缺陷。这些结果表明,具有低Mg掺杂的p-GaN肖特基接触的本表征方法是有效的,并且用作表面缺陷的灵敏表征。

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  • 来源
    《Thin Solid Films》 |2014年第30期|268-271|共4页
  • 作者单位

    Graduate School of Engineering, University of Fukui, 3-9-1 Bunkyo, Fukui 910-8507, Japan;

    Graduate School of Engineering, University of Fukui, 3-9-1 Bunkyo, Fukui 910-8507, Japan;

    Graduate School of Engineering, University of Fukui, 3-9-1 Bunkyo, Fukui 910-8507, Japan;

    Graduate School of Engineering, University of Fukui, 3-9-1 Bunkyo, Fukui 910-8507, Japan,Research and Development Laboratory, Corporate Advanced Technology Group, Hitachi Cable Ltd., 3550 Kidamari, Tsuchiura, Ibaraki 300-0026, Japan;

    Department of Electrical Engineering, University of Notre Dame, 228 Stinson Remick, Norte Dame, IN 46556, USA;

    Research and Development Laboratory, Corporate Advanced Technology Group, Hitachi Cable Ltd., 3550 Kidamari, Tsuchiura, Ibaraki 300-0026, Japan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    p-GaN; Contact; Damage; SiN deposition; ICTS;

    机译:氮化镓;联系;损伤;SiN沉积;信息技术委员会;

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