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机译:利用微旋转结构原位测定多晶硅薄膜的热膨胀系数
Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China;
Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China;
Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China;
Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China;
Thermal expansion coefficient; Micro-rotating structures; In situ measurements; Polycrystalline silicon; Thin films;
机译:多晶硅薄膜的热膨胀系数和残余应力的原位测试结构
机译:通过使用双夹紧梁测量热敏电导率和多晶硅薄膜的热膨胀系数
机译:具有不同热膨胀系数的基板上BI1-XSBX(0×0.15)薄膜的带结构参数
机译:用于确定多晶硅薄膜热膨胀系数的微旋转结构
机译:用于有源矩阵液晶显示器的低热预算多晶硅薄膜晶体管技术。
机译:多晶硅薄膜热扩散率的原位测试
机译:多晶硅薄膜热扩散率的原位测试
机译:离子束作为沉积和原位表征薄膜和薄膜分层结构的手段