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首页> 外文期刊>Thin Solid Films >The influence of substrate bias voltages on structure, mechanical properties and anti-corrosion performance of Cr doped diamond-like carbon films deposited by steered cathodic arc evaporation
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The influence of substrate bias voltages on structure, mechanical properties and anti-corrosion performance of Cr doped diamond-like carbon films deposited by steered cathodic arc evaporation

机译:衬底偏压对定向阴极电弧蒸发沉积Cr掺杂类金刚石碳膜结构,力学性能和耐腐蚀性能的影响

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摘要

Cr-doped diamond-like carbon films (Cr-DLC) were deposited on 304 stainless steel (304SS) substrates by a steered cathodic arc plasma evaporation with various negative bias voltages (-50 to -550 V). The Cr layer (-90 nm), CrN layer (-400 nm), transition layer and Cr-DLC layer (-3.2 mu m.) were deposited sequentially onto the substrate. The Raman spectra showed that the sp(3)/sp(2) ratio increased when the magnitude of bias voltage increased from 50 to 450 V and then it slightly decreased with further increase in the voltage. A dome-shaped morphology was found on the film deposited at low bias voltage due to incorporation of Cr droplets into the films and low mobility of adatoms. In addition, the crack in the conical structure and boundaries between the regular film and conical structure were also observed. The size of dome-shaped morphology and surface roughness decreased with increasing the bias voltage, which is attributed to enhanced surface mobility, increase in re-sputtering events above the droplets, and repulsion of droplets at higher bias voltages. The hardness significantly increased from 8.3 to 25.3 GPa when the bias voltage was increased from 50 to 450 V and then slightly decrease to 23.7 GPa as further increased to 550 V. The best corrosion current density of the film deposited at 450 V was 2.69 x 10(-8) A/cm(2), which is about 2-order of magnitude less than that of the bare 304SS plate (1.19 x 10(-6) A/cm(2)). The anti-corrosion properties and hardness were improved at higher substrate bias voltage due to the decrease in surface defects. The breakdown potentials of 304SS plates can be significantly improved from 0.75 V for bare samples to 1.3 V for those coated with Cr-DLC films. The passive current density of the Cr-DLC coated 304SS plate significantly decreased to around 1 x 10(-7) A/cm(2), because the pits did not penetrate through underlying Cr-DLC film. The optimum anti-corrosion performance and hardness was achieved for the samples deposited at a bias of -450 V. (C) 2015 Elsevier B.V. All rights reserved.
机译:Cr掺杂的类金刚石碳膜(Cr-DLC)通过带有各种负偏压(-50至-550 V)的导向阴极电弧等离子体蒸发在304不锈钢(304SS)基底上沉积。依次将Cr层(-90nm),CrN层(-400nm),过渡层和Cr-DLC层(-3.2μm)沉积在基板上。拉曼光谱显示,当偏置电压的大小从50 V增加到450 V时,sp(3)/ sp(2)的比率增加,然后随着电压的进一步增加而略有下降。在低偏压下沉积的薄膜上发现了圆顶状的形貌,这是由于Cr液滴掺入了薄膜中并且吸附原子的迁移率较低。另外,还观察到锥形结构中的裂纹以及规则膜和锥形结构之间的边界。圆顶形形态的大小和表面粗糙度随着偏置电压的增加而减小,这归因于增强的表面迁移率,液滴上方重新溅射事件的增加以及在较高偏置电压下液滴的排斥。当偏置电压从50 V增加到450 V时,硬度显着从8.3 GPa增加到25.3 GPa,然后再进一步增加到550 V时,硬度轻微降低到23.7 GPa。在450 V下沉积的薄膜的最佳腐蚀电流密度为2.69 x 10 (-8)A / cm(2),大约比裸304SS板低两个数量级(1.19 x 10(-6)A / cm(2))。由于表面缺陷的减少,在较高的衬底偏置电压下,抗腐蚀性能和硬度得到改善。可以将304SS板的击穿电位从裸露样品的0.75 V显着提高到涂有Cr-DLC膜的样品的1.3V。 Cr-DLC涂层304SS板的无源电流密度显着降低到大约1 x 10(-7)A / cm(2),因为凹坑没有穿透下面的Cr-DLC膜。对于在-450 V偏压下沉积的样品,可以获得最佳的防腐性能和硬度。(C)2015 Elsevier B.V.保留所有权利。

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