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首页> 外文期刊>Thin Solid Films >Strategy for silicon based hot-wire chemical vapor deposition without wire silicide formation
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Strategy for silicon based hot-wire chemical vapor deposition without wire silicide formation

机译:不形成硅化物的硅基热线化学气相沉积策略

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Silicide formation of wires during hot-wire chemical vapor deposition (HWCVD) of silicon based coatings is a key challenge which has to be overcome before HWCVD can be transferred successfully into industry. Silicide formation of tungsten wires is not occurring at temperatures of approximately 1900 degrees C and above when maintaining a silane partial pressure below approximately 1 Pa. Proceeding silicide formation at the cold ends where the wires are electrically contacted was completely prevented by continuously moving the cold ends of the wires into the hot deposition zone, resulting in a retransformation of the tungsten phase. Thus the maintenance period of a HWCVD manufacturing tool can be freed from wire lifetime. (C) 2014 Elsevier B. V. All rights reserved.
机译:在硅基涂层的热线化学气相沉积(HWCVD)过程中,线的硅化物形成是一项关键挑战,必须将HWCVD成功地转移到工业中之前,必须克服这一挑战。当将硅烷分压保持在大约1 Pa以下时,在1900摄氏度及以上的温度下不会发生钨丝的硅化物形成。通过连续移动冷端,可以完全防止在与电线电接触的冷端进行硅化物形成导线进入热沉积区,导致钨相的重新转变。因此,可以使HWCVD制造工具的维护周期免于导线寿命。 (C)2014 Elsevier B. V.保留所有权利。

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