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Incorporation and activation of arsenic in single-crystal CdTe layers grown by metalorganic chemical vapor deposition

机译:金属有机化学气相沉积法生长的单晶CdTe层中砷的掺入和活化

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The electrical properties of arsenic doped CdTe epitaxial layers grown on GaAs (100) substrates by metalorganic chemical vapor deposition with dimethylcadmium and diethyltellurium are investigated. Tris(dimethylamino) arsine was used as the arsenic source. CdTe layers with arsenic concentration from 1.6.10(17) cm(-3) to 1.5.10(18) cm(-3) were obtained by varying only diethyltellurium/dimethylcadmium mole ratio from 6.2 to 0.5. The asgrown CdTe: As layers had p-type conductivity with hole concentration about 2.10(15) cm(-3) within diethyltellurium/ dimethylcadmium mole ratio 1-6.2 and n-type at diethyltellurium/dimethylcadmium = 0.5. Postgrowth annealing (250-500 degrees C) were used to increase the activation efficiency of arsenic. The highest hole concentration was 2.1.10(17) cm(-3) at arsenic concentration of 4.5.10(17) cm(-3), but the maximum activation efficiency approximately of 85% was achieved at lower concentration levels. The ionization energy of As-Te acceptor determined from temperature-dependent Hall measurements was in the range of 96-112 meV. Low-temperature photoluminescence emission spectra of arsenic doped CdTe layers showed a peak at similar to 1.51 eV which is associated with As-Te acceptor with ionization energy about 90 meV. Possible mechanisms of arsenic compensation in
机译:研究了用二甲基镉和二乙基碲通过金属有机化学气相沉积法在GaAs(100)衬底上生长的掺砷CdTe外延层的电学性质。用三(二甲基氨基)ine作为砷源。通过仅将二乙基碲/二甲基镉的摩尔比从6.2更改为0.5,可以获得砷浓度从1.6.10(17)cm(-3)到1.5.10(18)cm(-3)的CdTe层。所生长的CdTe:As层具有p型电导率,在二乙基碲/二甲基镉摩尔比为1-6.2范围内的空穴浓度约为2.10(15)cm(-3),在二乙基碲/二甲基镉= 0.5时为n型。生长后退火(250-500摄氏度)用于提高砷的活化效率。在砷浓度为4.5.10(17)cm(-3)时,最高空穴浓度为2.1.10(17)cm(-3),但是在较低浓度水平下,最大活化效率约为85%。由温度依赖性霍尔测量确定的As-Te受体的电离能在96-112 meV的范围内。砷掺杂的CdTe层的低温光致发光发射光谱显示出一个峰,其峰值接近1.51 eV,这与As-Te受体的电离能约为90 meV有关。砷补偿的可能机制

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