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Electrical performance enhancement of p-type tin oxide channel thin film transistor using aluminum doping

机译:铝掺杂增强p型氧化锡沟道薄膜晶体管的电性能

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摘要

A narrow process window for the fabrication of p-type semiconductors is one of the major challenges in implementing tin oxide (SnOx) in thin film transistor applications. The SnOx lattice was doped with Al to widen the process window and enhance the p-type channel thin film transistor performance with co-sputtering process. A change in the growth orientation direction with the presence of Al in SnOx thin films was observed in the grazing-incidence X-ray diffraction data. The changes in the oxidation states of Sn ions were determines by X-ray photoelectron spectroscopy. With increasing Al concentration, the ratio of Sn4+ in the Sn peaks decreases indicating that the SnOx film has improved p-type properties. These changes led to an improvement of the electrical properties such as output characteristic, field effect mobility, subthreshold swing, and positive shift of threshold voltage. (C) 2017 Elsevier B.V. All rights reserved.
机译:在薄膜晶体管应用中实现氧化锡(SnOx)的过程中,用于制造p型半导体的狭窄工艺窗口是主要挑战之一。 SnOx晶格掺有Al,以扩大工艺窗口并通过共溅射工艺增强p型沟道薄膜晶体管的性能。在掠入射X射线衍射数据中观察到在SnOx薄膜中存在Al的情况下生长取向方向的变化。通过X射线光电子能谱测定Sn离子的氧化态的变化。随着Al浓度的增加,Sn峰中Sn4 +的比例降低,表明SnOx膜具有改善的p型性能。这些变化导致电特性的改善,例如输出特性,场效应迁移率,亚阈值摆幅和阈值电压的正向偏移。 (C)2017 Elsevier B.V.保留所有权利。

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