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Flash lamp annealing of indium tin oxide thin-films deposited on polyimide backplanes

机译:聚酰亚胺背板上沉积的铟锡氧化物薄膜的闪光灯退火

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摘要

Xe-arc flashings of 0.4-1.0 ms in pulse duration annealed indium tin oxide (ITO) thin-films deposited on flexible polymeric substrates at room temperature. As flexible substrates, highly transparent polyimide (PI) thin-films of 16 mu m in thickness were prepared on a carrier glass. Measuring optical characteristics of the ITO and the PI thin films and using the Maxwell equations, we estimated complex refractive indices of ITO and PI materials. With the use of these optical properties, one-dimensional conduction/radiation heat transfer simulation was carried out to predict the temperature variations in the specimens, assuring that the temperature in the ITO thin-film during the flash lamp annealing (FLA) process exceeded its crystallization point. Experimental FLA process resulted in a significant enhancement of the electrical conductivities as well as in a slight increase of optical transmittances of the specimen and was compared with the conventional furnace annealing (CFA) process of 1 h. Microscopic changes in the specimen during the annealing processes were compared using the X-ray diffraction pattern, atomic force microscope, and scanning electron microscope (SEM) measurements. Especially SEM images confirmed that sudden degradations in the electrical conductivities of ITO thin-films observed under higher power FLA or higher temperature CFA conditions were strongly related to the physical damages in the thin-films, which were incurred due to the thermal expansion mismatch between the ITO thin-film and the PI substrate at high temperatures. (C) 2017 Elsevier B.V. All rights reserved.
机译:Xe弧闪动的脉冲持续时间为0.4-1.0 ms,在室温下退火沉积在柔性聚合物基板上的铟锡氧化物(ITO)薄膜。作为柔性基板,在载体玻璃上制备了厚度为16μm的高度透明的聚酰亚胺(PI)薄膜。通过测量ITO和PI薄膜的光学特性,并使用Maxwell方程,我们估算了ITO和PI材料的复折射率。利用这些光学特性,进行一维传导/辐射传热模拟以预测样品中的温度变化,从而确保闪光灯退火(FLA)过程中ITO薄膜中的温度超过其温度。结晶点。实验FLA工艺导致电导率显着提高,并且样品的透光率略有增加,并且与1小时的常规炉退火(CFA)工艺进行了比较。使用X射线衍射图,原子力显微镜和扫描电子显微镜(SEM)测量比较了退火过程中样品的微观变化。尤其是SEM图像证实,在较高功率的FLA或较高的温度CFA条件下观察到的ITO薄膜电导率突然下降与薄膜的物理损伤密切相关,这是由于薄膜之间的热膨胀失配引起的。 ITO薄膜和PI衬底在高温下。 (C)2017 Elsevier B.V.保留所有权利。

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