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Analysis of grid electrode assisted plasma based ion implantation system and application to ion beam assisted deposition for insulator substrates

机译:栅电极辅助等离子体离子注入系统的分析及其在绝缘体衬底离子束辅助沉积中的应用

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A grid electrode assisted plasma based ion implantation system, which was originally designed only for ion implantation on insulator substrates, was investigated as a system of sputter deposition with high energy ion beam irradiation. When pulses of negative high voltage were applied to grid electrodes immersed in argon plasmas, high energy ions were observed to bombard the surface of the grid electrodes during the rise and plateau times of the pulses, using particle-in-cell (PIC) simulations. The resulting sputter deposition of atoms on the substrate from the stainless steel grid electrodes was confirmed by X-ray photoelectron spectroscopy. During the fall time of the pulses, PIC simulations indicated high energy ion beams of pseudowaves bombarded the surface of the substrate. Thus we verified that by using grid electrodes, ion beams can irradiate the insulator substrate after the sputter deposition within the time scale of a single pulse. In the proposed configuration, problems due to high voltage on insulator can be avoided because the insulator substrates float in plasmas for the entire process. Finally, we discuss potential application of the system for ion beam assisted deposition as a compact plasma based ion implantation and deposition system, which does not require a separate sputtering system.
机译:网格电极辅助的基于等离子体的离子注入系统最初被设计为仅用于绝缘体衬底上的离子注入,已被研究为具有高能离子束辐照的溅射沉积系统。当将负高压脉冲施加到浸没在氩气等离子体中的栅电极上时,使用单元内粒子(PIC)模拟,可以观察到高能离子在脉冲的上升和平稳时间内轰击栅电极的表面。通过X射线光电子能谱确认了从不锈钢格栅电极在基板上产生的原子溅射沉积。在脉冲的下降时间内,PIC仿真表明伪波的高能离子束轰击了基板表面。因此,我们验证了通过使用栅电极,离子束可以在单个脉冲的时间范围内在溅射沉积之后照射绝缘体基板。在所提出的配置中,由于绝缘体基板在整个过程中漂浮在等离子体中,因此可以避免由于绝缘体上的高电压引起的问题。最后,我们讨论该系统在离子束辅助沉积中的潜在应用,因为它是一种紧凑的基于等离子体的离子注入和沉积系统,不需要单独的溅射系统。

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