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机译:使用稳定的泡沫电解质溶液电镀镍膜
Yamada Co. Ltd.Ryouke, Naka-ku, Hamamatsu-shi, Shizuoka 430-0852;
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology Naka-cho, Koganei-shi, Tokyo 184-8588;
Yamada Co. Ltd.Ryouke, Naka-ku, Hamamatsu-shi, Shizuoka 430-0852;
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology Naka-cho, Koganei-shi, Tokyo 184-8588;
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology Naka-cho, Koganei-shi, Tokyo 184-8588;
electroplating; foam; hydrogen bubble; corrosion resistance; pinhole;
机译:在不同电解液中电镀的UV-LIGA镍薄膜的微观结构和力学性能的研究
机译:在超低电解温度下电镀镍膜
机译:在超低电解温度下电镀镍膜
机译:通过DC和脉冲DC电镀产生的纳米晶镍和镍 - 氧化铝薄膜
机译:添加剂对电镀钴-镍-铁薄膜磁性的影响。
机译:一站式解决方案-浸入式疏水过程辛基氧化石墨烯修饰的镍泡沫用于高效油水分离
机译:使用稳定的泡沫电解质溶液电镀镍膜