スルフアミン酸浴から形成したニッケルーマンガン電析合金めつきの物性評価

摘要

これまで電析めっき皮膜の用途は，装飾や防食が中心で あった。しかしながら，近年では機能的な用途への展開も活 発となっている。その中でもニッケル（以降，Niと記述）電 析めっきは，機械的，電気的な機能が必要とされる用途に用 いられることが多い。%Electroplated nickel films have physical properties such as high hardness and low internal stress, which result from the inclusion of stressreducing agents. However, sulfur inclusion causes brittleness when the plated films are exposed to a high-temperature environment. Nickel sulfide, which is formed when sulfur in a stress-reducing agent is included in plating, decreases the cohesive force of the crystal grains. This phenomenon, called sulfur brittleness, is an important difficulty related to electroplated nickel films. In the case of nickel electroforming for MEMS, the plating films must have low internal stress, high hardness, and high heat resistance without becoming brittle from sulfur inclusion. Many researchers have investigated nickel alloy plating as a way of suppressing this phenomenon. This study specifically assesses various properties of nickel manganese alloy plating. Results show the possibility of producing heat-resistant plated films while maintaining the required properties. ;Electroplating; Ni-Mn Plating; MEMS