机译:Si(100)-2×1:H表面的硅悬空键的扫描隧道光谱和密度泛函计算
Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;
Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;
Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;
Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Electrical and computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;
UHV-STM; silicon dangling bond; density functional calculations; scanning tunneling spectroscopy; hydrogen passivated silicon; Si(100) surface; dangling bond wire;
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机译:表征单电子隧道在硅表面上的两个悬空键之间的速率和相干性