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Scanning tunneling spectroscopy and density functional calculation of silicon dangling bonds on the Si(100)-2 × 1:H surface

机译:Si(100)-2×1:H表面的硅悬空键的扫描隧道光谱和密度泛函计算

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摘要

We studied electronic properties of atomic-scale dangling bond (DB) and DB wires on Si(100)-2×1:H surfaces using a ultrahigh vacuum scanning tunneling microscope (UHV-STM). The decay of the near-midgap DB-states induced by an unpaired DB depends on the crystalline orientation of the Si(100) surface. The decay length of the DB-states of an unpaired DB wire can be ~2.5 nm along the dimer row direction. The perturbation from an unpaired DB to an adjacent paired DB is also demonstrated. The results are in good agreement with density functional calculations.
机译:我们使用超高真空扫描隧道显微镜(UHV-STM)研究了Si(100)-2×1:H表面上的原子级悬挂键(DB)和DB导线的电子性能。由不成对的DB引起的近中带隙DB状态的衰减取决于Si(100)表面的晶体取向。未配对的DB导线的DB状态沿二聚体行方向的衰减长度可以为〜2.5 nm。还演示了从未配对的DB到相邻配对的DB的扰动。结果与密度泛函计算非常吻合。

著录项

  • 来源
    《Surface Science》 |2013年第3期|147-151|共5页
  • 作者单位

    Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;

    Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;

    Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;

    Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;

    Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;

    Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States,Department of Electrical and computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    UHV-STM; silicon dangling bond; density functional calculations; scanning tunneling spectroscopy; hydrogen passivated silicon; Si(100) surface; dangling bond wire;

    机译:UHV-STM;硅悬空键密度泛函计算扫描隧道光谱氢钝化硅;Si(100)表面;悬空键合线;

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